HW Application Engineer - SI/PI

Nuvia

Nuvia

Taipei City, Taiwan
Posted on Feb 20, 2025

Job Description

Job Posting Date

2025-02-20


Company:

Qualcomm Communication Technologies Ltd.

Job Area:

Engineering Group, Engineering Group > Hardware Applications Engineering

General Summary:

The candidate will work within customer engineering team and need to provide electrical design expertise/simulation directly to customers in the areas of signal integrity and power integrity for the design of compute/wireless products and development systems.

Responsibilities

  • Perform various PCBA board level PDN and SI simulation analyses using established methodologies, potentially from model extraction through simulation and reporting of conclusions. IO types include DDR memory, USB4, PCIe, MIPI CSI, eDP interfaces and variety of serial interfaces.
  • Perform laptop motherboard compliance end to end simulation ( ie: eye pattern) from SoC to Camera module ,USB connector via FPC/ retimer, eDP panel by using IBIS model.
  • Analyze and provide design guidance on PCB power distribution networks using established methodologies.
  • Document, distribute, and present results at appropriate meetings.


Qualifications

2 to 4 years of experience in the following areas:

  • Electromagnetic theory and transmission lines
  • Basic signal and power integrity concepts
  • Commercial 3D electromagnetic field solver
  • Commercial SI or RF analysis tools
  • SPICE transient simulation including use of IBIS models


The following experience is a plus:

  • DDR and LPDDR design and analysis
  • High speed serial IO design and analysis
  • Ansys, Cadence/Sigrity, Keysight, SI/PI tools, and MATLAB desirable
  • Spreadsheets and similar productivity tools
  • Mentor or Cadence board design tools
  • Candidates having sound knowledge in Signal processing techniques, Electromagnetic theory, Transmission lines design concepts will be highly preferred.

Education Requirements

  • Minimum Bachelor degree in Electrical Engineering or related discipline, Master degree preferred
  • You will be responsible for end-to-end interconnect design signoff and design guidelines for external customers.

Minimum Qualifications:

• Bachelor's degree in Electrical/Electronics Engineering, Computer Engineering, or related field and 2+ years of Hardware Applications Engineering or Hardware Design experience or related work experience.
OR
Master's degree in Electrical/Electronics Engineering, Computer Engineering, or related field and 1+ year of Hardware Applications Engineering or Hardware Design experience or related work experience.
OR
PhD in Electrical/Electronics Engineering, Computer Engineering, or related field.

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