Nuvia
General Summary:
Qualcomm's Package Engineering Team has an opening for Datacenter Substrate Engineer position. This team is responsible for next generation of Substrate for Datacenter package, especially various types of AI & Sever package. Team is participating in paving roadmaps, defining architecture, design rules and specifications for Datacenter Substrate. We are seeking a highly motivated engineer who will collaborate within a team and work with cross-functionally with planners, designers, assembly engineers, quality engineers and suppliers.
Responsibilities:
Working with Marketing/IC/product teams on competitive analysis and road mapping package technology for future products.
Responsible for advanced package substrate development (SiP, FCBGA, FCCSP).
Responsible for defining Datacenter Substrate process flows, design rules and specifications.
Responsible for leading and co-working package substrate suppliers to enable new product launches.
Working with internal design team and driving DFM for next generation of Datacenter Substrates.
Responsible for defining root cause and corrective actions when quality issues happen during development period.
Minimum qualifications:
Bachelor's degree in material science/chemical/mechanical/electrical engineering and 8+ years of substrate process and/or integration, or related work experience.
Preferred qualifications:
Master's degree in material science/chemical/mechanical/electrical engineering.
Over 10 years of hands-on experience working in IC packaging substrate manufacturing factory (SiP, FCBGA, FCCSP).
Understanding of organic laminate raw materials, manufacturing, role of packaging on product electrical & thermal performance, JEDEC standard component & board level reliability testing.
Knowledge in DOE, control plan, FMEA, SPC and other statistical process control methods.
Proficiency in material and characterization data analysis, and statistical data analysis using tools like JMP and Minitab.
Knowledge of package reliability test methods and qualification procedure.
Working knowledge of package assembly process flow.
Proficiency to analyze any photos or results taken by FA tools (Optical microscopes, SEM, C-SAM, FIB, EDX, X-ray, EPMA, TDR, …).
Strong team player & project management skills.
Good verbal and written communication/language skills.
Minimum Qualifications:
• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
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