Company:
Qualcomm Semiconductor Limited
Job Area:
Engineering Group, Engineering Group > ASICS Engineering
General Summary:
Qualcomm Overview:
Qualcomm is a company of inventors that unlocked edge AI and connected computing ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform high performance AI and connected computing potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.
General Summary:
Job Overview:
The Qualcomm Memory System/Technology Team in Process & Package Solutions Group has an opening in the areas of custom DRAM design and architecture for memory-centric compute systems for data center, mobile, compute, and XR. The candidate will design bus circuits and power distribution network for the custom DRAM to improve system KPIs such as bandwidth, latency, power, and thermal. The candidate will work on solutions of high-speed and high-bandwidth bus design for advanced memory. The candidate should have familiarity with the bus and compute fabrics as well as advanced packaging and 3D integration. This position offers the opportunity to work across multiple organizations such as process and packaging team, AI and compute architects, memory controller team, global SoC team, and emulation team. Providing timely feedback and updating architecture and design trade-offs to the team is essential.
Responsibilities:
Develop and optimize circuits for high-bandwidth memory bus and PDN control, timing, and control
Analyze and ensure the integrity of signals on the bus and PDN across PVT corners
Develop and validate the bus behavior for various access protocols to meet throughput, latency, and energy specifications
Develop novel fabrics for best/robust distribution of high-bandwidth busses and PDN across the DRAM array, compute, and IO
Create layouts that optimize the bus and PDN placement for routability across the whole chip
Use state-of-the-art design and simulation tools to simulate the bus behavior and manufacture readiness
Develop behavioral, timing, and power models of the bus to guide the architecture choices across AI, compute, and mobile workloads
Develop power modeling framework to build state-dependent power and determine PMIC requirements
Floorplan 3D DRAM chips under 3D integration manufacturing constraints, testability, repairability, and high performance
Minimum Qualifications:
Experience in memory bus design (SRAM/DRAM/Flash/ROM/OPT, etc)
Good knowledge of bus communication protocols
Knowledge of high-speed design principles and reliability
Ability to assess the robustness of bus architecture that interacts with multiple modules such as DRAM bank, PHY, and memory controller
Ability to develop Verilog/Verilog-A/Verilog-AMS models of critical datapath
Experience in mixed-signal design, layout, and simulation
Proficiency in use of EDA tools, Matlab, and Phyton
Good knowledge of memory architecture, buses, and 2.5D/3D integration
Master's or Ph.D. in Electrical Engineering and a related field
Preferred Qualifications:
Experience in DRAM architecture performance assessment
Experience in programming language (C/C++/Phyton) or scripting language (Perl/Python)
Familiar with the DRAM datasheets and IO interfaces
Soft Skills:
Self-Starter with good communication skills and team-working spirit
Strong problem-solving and analytical skills
Ability to work independently and as part of a team
Minimum Qualifications:
• Bachelor's degree in Science, Engineering, or related field and 6+ years of ASIC design, verification, validation, integration, or related work experience.
OR
Master's degree in Science, Engineering, or related field and 5+ years of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.
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