Company:
Qualcomm Semiconductor Limited
Job Area:
Engineering Group, Engineering Group > ASICS Engineering
General Summary:
General Summary:
We are looking for a highly motivated packaging engineer capable of leading state-of-the-art advanced IC packaging development and new product introduction of leading-edge package technologies for AI, Mobile, Bluetooth, WiFi, IoT, Power Management, Connectivity Automotive and new emerging markets and driving that innovation into high volume manufacturing in assembly suppliers. Extensive knowledge and experience in Flip Chip, Wire bond and System in Package assembly process, materials, and equipment are required. The position also requires the ability to lead multi-functional teams and solve complex technical problems in working with multiple OSATs. Experience or worked on projects with Wafer-on-Wafer bonding is a plus.
Duties and Responsibilities:
- Responsible for exploring, development and HVM deployment of FCCSP, FCBGA, and/or SiP/Module packaging technologies.
- Responsible for initiating & defining package process flow, material set/ BKM, test vehicle, DOEs & cornering, process control plans to successfully develop manufacturable and reliable products.
- Interface with OSATs, substrate/ material suppliers, and tool makers in developing technology related to product requirements. Align with internal product teams on Design Rule and its establishment.
- Associate with internal design team and drive DFM methodology for new technologies.
- Work with internal design, modeling and procurement teams to implement technically best and lowest cost packaging.
- Technical program management to plan, execute, and monitor complex processes or product developments. Regular updates on program status to management and share with cross team members.
- Good knowledge and understanding of FMEA, SPC/QC concepts, failure mechanism and failure analysis process techniques, manufacturing floor operations and Quality issue handling.
Minimum Qualifications
- Minimum of 10 years of experience in the development and high-volume manufacturing of advanced IC packages.
- Expertise in Flip Chip CSP, FCBGA and SiP packaging materials, assembly processes, equipment, and design rules.
- Strong understanding of Laser Groove technology and Wire bond process optimization.
- Excellent verbal and written communication skills.
- Exhibit organized technical project management skills.
- Able to work independently and lead multiple programs.
- Able to lead multi-functional teams to solve complex technical problems.
- Self-driven, passionate, and creative.
Preferred Qualifications
- Hands on experience in package manufacturing, experience in technical project management, and working first-hand with semiconductor material suppliers.
- Understanding industry packaging trends, end-user packaging considerations, and previous experience with high-end mobile consumer products.
- Proficiency in material and package characterization and statistical data analysis.
- Knowledge of reliability test methods and qualification procedure.
- Six Sigma Green or Black belt a plus.
Educational Requirements
- Required: Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, related degree or equivalent practical experience.
- Preferred: Master's degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, related Engineering field.
Minimum Qualifications:
• Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.
OR
Master's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.
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