Principal Engineer, Chiplet & 3D Architecture Solutions

Nuvia

Nuvia

IT
San Diego, CA, USA
USD 192k-288k / year + Equity
Posted on Nov 21, 2025

Job Description

Job Posting Date

2025-11-20


Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > ASICS Engineering

General Summary:

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives communication and data processing transformation to help create a smarter, connected future for all. In this journey, Qualcomm is evolving into an “AI-first” intelligent-edge powerhouse, combining high-performance, low-power compute and seamless connectivity while pushing intelligence closer to users through ultra-efficient, on-device AI that ensures privacy, personalization, and real-time responsiveness.

Job Overview and Responsibility

We are seeking a highly skilled engineer to develop technology solutions for slowing Moore’s law era encompassing advanced architecture partitions involving logic and multi-hierarchical memories, chiplets, and 3D integration.

Candidate will also drive innovation in the group to effectively map emerging system use cases to process and chip-integration solutions with detailed knowledge of process technology, chiplet architecture and trade-offs, SRAM/DRAM memory integration etc.

Candidate will work with internal architecture and system teams to develop 3D cache and DRAM partitions and map to 3D stacking topologies. Candidate will perform system KPI analysis to drive 3D architecture and stacking strategies for new product introduction.

Candidate will collaborate with high-level representatives across functional teams (e.g. Architecture, product management, Design teams) to develop and execute an implementation strategy that meets system requirements.

Minimum Qualifications:

  • Thorough understanding of semiconductor process technology, and design KPI dependency on process architecture.
  • Good understanding of overall system KPI and dependencies on chiplet-integration schemes.
  • Good knowledge of memory architecture, 3D integration schemes.
  • Ability to model system use case impact of 3D SRAM and DRAM architectures and integration schemes.
  • Ability to map emerging system use cases to hardware, chiplet and process architecture solutions; and vice versa
  • Experience in SoC and System level Design flows
  • Master's or Ph.D. in Electrical Engineering, Computer Science, or a related field

Additional Qualifications:

  • Exceptional creativity to innovate new ideas and develop innovative products/ processes without established objectives or known parameters.
  • Verbal and written communication skills to convey highly complex and/or detailed information. Will require strong negotiation and influence with large groups or high-level constituents
  • Ability to work independently and as part of a team
  • Most tasks do not have defined steps; simultaneous use of multiple mental abilities is generally required to determine the best approach
  • Deductive and inductive problem solving is required; multiple approaches may be taken/necessary to solve the problem; often information is missing or conflicting; advanced data analysis and interpretation skills are required.

The ideal candidate will have:

• Bachelor's degree in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience.
OR
Master's degree in Science, Engineering, or related field and 7+ years of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field and 6+ years of ASIC design, verification, validation, integration, or related work experience.

Minimum Qualifications:

• Bachelor's degree in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience.
OR
Master's degree in Science, Engineering, or related field and 7+ years of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field and 6+ years of ASIC design, verification, validation, integration, or related work experience.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range and Other Compensation & Benefits:

$192,000.00 - $288,000.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.