Nuvia
General Summary:
As a Qualcomm Package System Design and Technology Engineer, you will drive new advanced package technology development, concept design architecture analysis from package to system, new generation product package structure selection, package system design by multi-physics simulation analysis, multi-physics lab validation/correlation of package to system models, and the manufacturing qualification for new product introduction (NPI). Package System Design and Technology Engineers collaborate with multi-disciplinary teams to achieve optimized performance of mechanical, electrical, and thermal package systems for various end market applications. This role interfaces with internal/external IP teams, industry standards, and vendors to set package to system design and technology specifications; enabling product designs to achieve high performance, high reliability, low cost, and easy to implement system with integrated component attaches for end customers.
Minimum Qualifications:
• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.Preferred Qualifications:
• Master's Degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.
Principal Duties and Responsibilities:
• Applies Package System Design and Technology knowledge to assist in package product design layout, design multi-physics optimizations, design verification (DV), design tool flow development and tape out of discrete package or SiP/Module for all forms of bare silicon products (single or multi-die).
• Supports package to system cooling architecture and design through simulations and lab validation.
• Supports package to system electrical analysis and simulations for digital IP, analog IP, and external components; assists in the development of SIPI, analog and PDN package system solutions, and contributes to the implementation and validation of SIPI and PDN designs across SoC, substrate, interposer, components and system platforms.
• Assists in simulating package mechanical interactions to support design, material, and reliability optimization, contributing to improved product development efficiency
• Supports empirical testing on materials and devices, characterize mechanical/electrical performance, and analyze board/system level interactions.
• Assists in the development of packaging technology solutions for various end market applications to meet performance and cost targets.
• Assists in the development (structure/process/material/DRM), evaluation, and qualification of next-generation substrate technologies for advanced semiconductor packaging.
• Assists in the development and integration of next-generation heterogeneous integration solutions, including substrate, bridge die, and interposer 2.5D chiplet architectures.
• Supports the development and optimization of complex 3D integration technologies, including die-to-wafer, die-to-die, and wafer-to-wafer stacking for STCO; contributes to enabling high-density interconnects and implementing design rules to ensure reliable and high-yield die stacking technology.
• Collaborates with team members to accomplish goals while meeting quality expectations.
Level of Responsibility:
• Works under supervision.
• Decision-making affects direct area of work and/or work group.
• Requires verbal and written communication skills to convey basic, routine factual information.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
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Pay range and Other Compensation & Benefits:
$108,400.00 - $162,600.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.