Nuvia
General Summary:
As a leading technology innovator, Qualcomm pushes the boundaries of what's possible and drives communication and data processing transformation to help create a smarter, connected future for all. In this journey, Qualcomm is evolving into an “AI-first” intelligent-edge powerhouse, combining high-performance, low-power compute and seamless connectivity while pushing intelligence closer to users through ultra-efficient, on-device AI that ensures privacy, personalization, and real-time responsiveness. This is the Invention Age - and this is where you come in.
Job Overview and Responsibility
We are seeking a highly skilled engineer to develop 2.5D/ 3D chiplet and networking solution based technology-systems co-optimized for a unique era of heterogeneous compute as Moore’s law slows down. He/she should be able to apply that knowledge to define Qualcomm’s next generation SoC and platform architectures including partitions for logic and memories and involving 2.5D/3D chiplets and networking technologies to connect them.
Candidate will also drive innovation in the group to effectively map emerging AI and other compute use cases to process and chip-integration solutions with detailed knowledge of process technology, 2.5D/ 3D chiplet architecture, networking technologies and trade-offs. Knowledge of different Ips e.g. CPU, GPU, NPU and how they act together to drive an E2E use case is a plus. Candidate will work with internal architecture and system teams to develop 2.5D/3D partitions and map to 3D stacking topologies. Candidate will perform system KPI analysis to drive 3D architecture and stacking strategies for new product introduction.
Minimum Qualifications:
Excellent understanding of generic and AI use case KPI dependency on process and system architecture involving chiplets and networking technologies.
Good knowledge of heterogeneous architecture, 2.5D/ 3D integration schemes.
Basic programming skills e.g. ability to model e.g. in Python or other languages system use case impact of 3D architectures, integration schemes.
Master's in Electrical Engineering, Computer Science, or a related field
Additional Qualifications:
Ability to work without much supervision and as part of a team
Most tasks do not have defined steps; simultaneous use of multiple mental abilities is generally required to determine the best approach
Advanced data analysis and interpretation skills are required.
Minimum Qualifications
• Bachelor's degree in Science, Engineering, or related field and 5+ years of AI relevant System and technology or related work experience. .
OR
Master's degree in Science, Engineering, or related field and 4+ years of AI relevant System and technology or related work experience.
OR
PhD in Science, Engineering, or related field and 3+ years of AI relevant System and technology or related work experience.
Minimum Qualifications:
• Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
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