The successful candidate will operate as a member of Corporate Engineering Hyderabad department. Responsibilities include working with US and India teams to perform thermal and structural analysis of high-performance electronic assemblies. Specific tasks include daily use of thermal and structural analysis software, taking concept layouts from the design team, creating representative analytical models, defining boundary and loading conditions, running simulations, analyzing results, and making recommendations for optimization of designs. The Sr. Engineer will interface with internal staff and outside partners in the fast-paced execution of a variety of multi-disciplined projects.

Minimum Qualifications:

Bachelor's OR Master’s degree in Mechanical/Thermal/ Electronic Engineering or a related field.
4+ years actively involved in thermal and structural engineering analysis of high-density electronics packaging.
Strong background in heat transfer fundamentals with a good understanding of electronics cooling technologies (passive and active).
Knowledge of packaging technologies, electromechanical design, and thermal management materials.
Analysis tools experience utilizing Flotherm,XT, Icepak, 6SigmaET, Celsius EC, Ansys, Abaqus, or equiv.
Experience in forced cooling solutions for chassis / systems & Racks.
Experience in Analysis for Liquid cooling solutions for systems.
Desired to have Solid modeling experience utilizing Pro/E or Solidworks mechanical CAD system.
Proven ability to work independently and collaboratively within a cross-functional team environment.
Strong technical documentation skills and excellent written and verbal communication.

Minimum Qualifications:

• Bachelor's degree in Mechanical Engineering or related field and 2+ years of Mechanical Engineering or related work experience.
OR
Master's degree in Mechanical Engineering or related field and 1+ year of Mechanical Engineering or related work experience.
OR
PhD in Mechanical Engineering or related field.

Required Skills & Experience

5+ years of experience in IP verification for ASIC designs.
Strong expertise in System Verilog, SVA, UVM, and Verilog.
Solid understanding of ASIC design flow and design fundamentals.
Proven experience in testbench architecture, testbench development, test plan creation, and coverage analysis.
Hands-on experience with latest debug tools and methodologies.
Knowledge of AI/ML concepts and their application in verification is a strong plus.
Excellent communication, problem-solving, and documentation skills.
Protocols – AHB, APB, AXI is a strong plus.

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

If you would like more information about this role, please contact Qualcomm Careers.

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