As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Software Engineer, you will design, develop, create, modify, and validate embedded and cloud edge software, applications, and/or specialized utility programs that launch cutting-edge, world class products that meet and exceed customer needs. Qualcomm Software Engineers collaborate with systems, hardware, architecture, test engineers, and other teams to design system-level software solutions and obtain information on performance requirements and interfaces.

Minimum Qualifications:

• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 2+ years of Software Engineering or related work experience.
OR
Master's degree in Engineering, Information Systems, Computer Science, or related field and 1+ year of Software Engineering or related work experience.
OR
PhD in Engineering, Information Systems, Computer Science, or related field.

• 2+ years of academic or work experience with Programming Language such as C, C++, Java, Python, etc.

Job Title: Thermal Engineer – Server SoC / Thermal Management and solutions

(Levels: Engineer/Sr. Engineer/Sr. Lead Engineer/Staff Engineer/Sr. Staff Engineer)

About the Role:

Qualcomm PPAT Thermal Team is looking for Thermal Engineers to design, analyze, and optimize thermal solutions for high-power server-class SoCs. You will work closely with silicon design, package, mechanical, platform, and system teams to ensure reliable thermal performance across critical server environments.

This role is ideal for engineers with hands-on experience in CPU / GPU / accelerator thermal management, especially from Intel, AMD, NVIDIA, or similar semiconductor companies working on data center and similar products.

Key Responsibilities:

Thermal Solution Development

· Thermal Architecture & Analysis: Perform steady-state and transient thermal analysis at :

- Die level
- Package level
- System level (heat sink, cold plate, airflow)

Define and evaluate air-cooled and liquid-cooled thermal solutions:
- Heat sinks, vapor chambers, cold plates
- TIM selection and optimization
- Direct-to-chip and immersion cooling considerations
Collaborate with platform teams on server mechanical and airflow design.

Support power-thermal co-optimization during silicon bring-up.

Validation & Correlation

Define and execute thermal validation plans:
- Lab measurements (thermocouples, IR, embedded sensors)
- Power virus and workload-based testing
Correlate simulation vs lab data and drive design improvements.

Cross-Functional Collaboration

Partner with:
- Silicon design & power teams
- Package & mechanical engineering
- Platform, BIOS, and firmware teams
- External ODM/OEM and cooling vendors
Provide thermal guidance during platform bring-up and customer engagements.

Required Qualifications

Education

Bachelor’s or Master’s degree in Electronics/Electrical/ Thermal Engineering, or related field.

Experience

2–5 years of experience in thermal engineering for:
- Server CPUs, GPUs, accelerators, or high-power SoCs
- Semiconductor or data-center hardware products
Strong preference for experience at Intel, AMD, NVIDIA, Broadcom, or similar companies.

Technical Skills

Strong fundamentals in heat transfer, thermodynamics, and fluid mechanics
Hands-on experience with thermal simulation tools
Experience with TIM characterization, heat sink optimization, and airflow modeling
Understanding of package-level thermal challenges (hotspots, non-uniform power maps)
Focus on simulations, validation, and platform support
Use case ownership, Strong tool usage and fundamentals

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

If you would like more information about this role, please contact Qualcomm Careers.

Apply now

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